Core Applications of Mold Components in Electronic Device Manufacturing
Core applications: cell phone metal case stamping, Type-C connector micro-stamping, CPU heatsink die-casting Key accessories: carbide micro-punching needles (Φ0.15mm), beryllium copper thermally conductive inserts (thermal conductivity 210W/mK) Technical benefits: stamping accuracy ±2μm (Lixin Precision Connector), injection cycle compressed to 9 seconds (Foxconn iPhone center frame mold)
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Core applications: body cladding stamping (doors/hood), powertrain forging (crankshaft/connecting rods), interior injection molding (instrument panels) Key accessories: high-precision guide pillar/guide sleeve (hardness HRC60±2), 3D-printed randomly shaped waterway inserts (thermal conductivity ≥80W/mK) Technological benefits: stamping positioning accuracy ≤0.01mm, 55% improvement in cooling efficiency (NINGDER TIMES BATTERY BOX MOULD) )
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