product description
In micro-pitch IC packages and medical catheter molds, static discharge of 0.1 μ A is sufficient to destroy the chip, while the adhesive problem of traditional steel needles leads to a rejection rate of up to 25%. Our aviation-grade beryllium copper needles (C17200) are age hardened with nano-nickel coating for ultra-high electrical conductivity (85% IACS) And adhesion resistance, maintaining ± 0.001 mm thermal stability at 150℃ operating conditions, is 5G communications, implantable medical devices to provide static zero ejection solution.

Product Features
1. Electrostatic zeroing system
- Double channel relief design:
- Straight through die ground wire of needle body (resistance < 0.1 Ω)
- Nickel plating to form Faraday cage shielding field
- μ Conductivity assurance: beryllium copper substrate oxygen content ≤ 30ppm, conductivity fluctuation < 1%
- Intelligent anti-sticking: surface micro-textured oil storage pits (Ø 0.02 mm), realization of air film demoulding
2. Thermal stability of the aerospace class
- Zero thermal deformation process: cryogenic treatment (-196℃× 24h) → age hardening (320℃×3h)
- Creep resistant structure: grain size ≤ 10μm, 300% increase in high temperature yield strength
- Self-compensating coating: thermal expansion coefficient of nickel coating matching beryllium copper substrate (17.5 × 10 ⁻⁶ / ℃)

Product Application Scenarios
1. Microelectronic packaging: BGA chip ejection, Type-C interface demoulding
2. Medical implant: anti-static ejector pin of nerve electrode mould
3. Optical communication: SFP module ceramic pin ejection without damage
4 Automotive Electronics: ESD protection of ECU control module ejection system